(1) Design and Implementation of a Compact 3D stacked RF Front End Module for Micro Base Station, IEEE Transactions on CPMT, 2018, 通讯作者
(2) Investigation of intermetallic compound and voids growth in fine-pitch Sn–3.5Ag/Ni/Cu microbumps, Journal of Materials SCIence: Materials in Electronics, 2017, 通讯作者
(3) Thermo-mechanical reliability analysis of a RF SiP module based on LTCC substrate, Microelectronics Reliability, 2017, 通讯作者
(4) Fabrication and performance analysis of a high-coupling-efficiency and convenient-integration optical transceiver, Optoelectronics Letters, 2017, 通讯作者
(5) Design and implementation of a rigid-flex RF front-end System-in-Package, Microsystem Technologies, 2017, 通讯作者
(6) Design and fabrication of a small-form transmitter optical subassembly for 100Gbps short reach optical interconnect, Microwave and Optical Technology Letters, 2017, 通讯作者
(7) Experimental and Numerical Study of 3D Stacked Dies under Forced Air Cooling and Water Immersion, Microelectronics Reliability, 2017, 通讯作者
(8) 硅基光栅耦合封装结构的优化设计, 激光技术, 2017, 通讯作者
(9) Study on a Conformal Shielding Structure with Conductive Adhesive Coated on Molding Compound in 3D Packages, IEEE Transactions on Electromagnetic Compatibility, 2016, 通讯作者
(10) Design of a compact silicon-based integrated passive band-pass filter with two tunable finite transmission zeros, Microelectronics Journal, 2016, 第 4 作者
(11) Design and implementation of a 700–2,600 MHz RF SiP module for micro base station, Microsystem Technologies, 2014, 通讯作者
(12) High Bandwidth Silicon Millimeter Waveguides, Microwave and Optical Technology Letters, 2013, 第 3 作者
(13) Joule Heating effect on Oxide Whisker Growth Induced by Current Stressing in Cu/Sn-58Bi/Cu Solder Joint, Electronic Materials Letters, 2012, 第 2 作者
(14) Dielectric enhancement of BaTiO3/BaSrTiO3/SrTiO3 multilayer thin films deposited on Pt/Ti/SiO2/Si substrates by sol–gel method, Materials Letters, 2011, 第 3 作者